BAI  YU

A Senior Hardware Engineer and PCB Designer

Personal Web: http://www.spidy.info/baiyu

Email: baiyu113727@126.com

Mobile: 11-86-13891915470; Home: 11-86-88219734

Summary of Experience:

I have fifteen years experience designing all kinds of PCB, including high speed digital boards, RF boards and high density integrated boards (HDI), using Protel and Cadence PSD13/14/15.2(conceptHDL for schematics/Allegro for PCB design). Moreover, I have five years experience of high speed board SI,PI and EMC simulation using Cadence PSD tools like Sigxplorer, Specctraquest,etc.The successful products in my design involve smart antenna’s base band processing boards, WLAN cards, CDMA handphone boards,ADSL and high speed LAN router boards.

In short, I can bring an electrical design from concept to a PCBA for testing.

Education:

1999.9 – 2002.4 Department of Electronic Engineering,

                        Northwestern Polytechnic University, Xi’an, China

                        MS Degree (2002.4);

1996.5 – 1998.6                        Department of Mechanical & Production Engineering,

                        National University of Singapore, Singapore, Republic of,

                        MS Degree (1999.3);

1989.9-1993.7                        Department of Mechanical Engineering,

                        Xi’an Jiaotong University, Xi’an, China

                        BE Degree (1993.7);

Work Experience:

2002.4-today                        ZTE Xi’an Institute, China

                        Senior R&D Engineer ( EDA Engineer and Signal Integrity Engineer)

Duty:

1.      Schematic review and library building (Cadence PSD 15.2: Concept and Library Explorer)

2.      Critical signal’s pre-layout SI simulation (Specctraquest , SigXplorer and HSPICE)

3.      Solution spacing layout and auto-routing’s DO file writing (Allegro and Specctra) for digital board.

4.      Digital board’s Power Integrity analysis (SIWAVE) and EMC control.

5.      RF board layout and post-layout simulation (Ansoftlinks and HFSS)

6.      RF board’s micro-strip line calculation and simulation (ADS).

7.      PCB design for manufacturing check.

8.      PCB design for test check.

9.      Manufacturing data generation: NC data and Gerber files

10. Allegro Package library’s creation.

11. Library database’s management.

12. Contact with PCB manufacturer for design data’s verification ( such as impedance control and board materials permittivity )

13. Hand-phone PCB design ( HDI board ).

1998.6-1999.8                        Celestica DongGuan, China

                        Advanced Manufacturing Engineer

Duty:

1.      New SMT technology and equipment introduction and review

2.      Complicated board’s stencil design and manufacturing process control

3.      Junior manufacturing engineer’s training.

1993.7-1996.4                        QinChuan Machinery Company, China

                        PCB Engineer

Duty:

1.      PCB layout (RF and digital).

2.      Digital circuit design and board layout.

3.      8031/8051 Microchip BSP.

4.      Digital board’s SI simulation.

Software Skills:

1.      Cadence PSD15.2 (Allegro ,Concept HDL, SQ and CCT)

2.      Ansoftlinks and SIWAVE

3.      HFSS

4.      ADS

5.      Matlab

6.      Micro-office

PCB Design Skills:

1.      Multi-layer board design ( 12 layers experience) and layer allocation.

2.      HDI board design and micro blind/bury via design (hand-phone PCB design:CDMA,GSM).

3.      Micro-strip and strip-line calculation and design

4.      Differential Pair’s calculation and layout

5.      SI and PI simulation.

6.      EMC control

7.      Auto-routing and the corresponding DO files writing.

8.      Library creation and management

Self Comment:

Self-motivated team player and have confidence to get the message to Garcia.